Devendra K. Sadana
827Patents
28h-index
318Co-inventors
93Inventor score
Filing activity: Nov 26, 1980 → Sep 25, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5767549A | SOI CMOS structure | Electricity | 356 | Expired |
| US6642090B1 | Fin FET devices from bulk semiconductor and method for forming | Electricity | 351 | Expired |
| US6958286B2 | Method of preventing surface roughening during hydrogen prebake of SiGe substrates | Emerging Cross-Sectional Technologies | 234 | Expired |
| US7772096B2 | Formation of SOI by oxidation of silicon with engineered porosity gradient | Electricity | 196 | Active |
| US6333532A | Patterned SOI regions in semiconductor chips | Emerging Cross-Sectional Technologies | 183 | Expired |
| US6566177B1 | Silicon-on-insulator vertical array device trench capacitor DRAM | Electricity | 181 | Expired |
| US6214694A | Process of making densely patterned silicon-on-insulator (SOI) region on a wafer | Electricity | 149 | Expired |
| US6717216B1 | SOI based field effect transistor having a compressive film in undercut area under the channel and a method of making the device | Electricity | 148 | Expired |
| US6432754B1 | Double SOI device with recess etch and epitaxy | Electricity | 122 | Expired |
| US8178430B2 | N-type carrier enhancement in semiconductors | Emerging Cross-Sectional Technologies | 115 | Active |
| US7087965B2 | Strained silicon CMOS on hybrid crystal orientations | Electricity | 84 | Expired |
| US6991998B2 | Ultra-thin, high quality strained silicon-on-insulator formed by elastic strain transfer | Electricity | 75 | Expired |
| US6541356B2 | Ultimate SIMOX | Electricity | 60 | Expired |
| US8169025B2 | Strained CMOS device, circuit and method of fabrication | Electricity | 57 | Active |
| US7524740B1 | Localized strain relaxation for strained Si directly on insulator | Electricity | 55 | Active |
| US9472588B1 | Monolithic visible-infrared focal plane array on silicon | Electricity | 55 | Active |
| US5930643A | Defect induced buried oxide (DIBOX) for throughput SOI | Electricity | 52 | Expired |
| US6180486A | Process of fabricating planar and densely patterned silicon-on-insulator structure | Electricity | 52 | Expired |
| US7358166B2 | Relaxed, low-defect SGOI for strained Si CMOS applications | Electricity | 50 | Expired |
| US8247261B2 | Thin substrate fabrication using stress-induced substrate spalling | Emerging Cross-Sectional Technologies | 49 | Active |
| US6426252B1 | Silicon-on-insulator vertical array DRAM cell with self-aligned buried strap | Electricity | 49 | Expired |
| US8912020B2 | Integrating active matrix inorganic light emitting diodes for display devices | Electricity | 46 | Active |
| US6177289A | Lateral trench optical detectors | Emerging Cross-Sectional Technologies | 41 | Expired |
| US6300218A | Method for patterning a buried oxide thickness for a separation by implanted oxygen (simox) process | Electricity | 38 | Expired |
| US8937299B2 | III-V finFETs on silicon substrate | Electricity | 35 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.