Silicon wafer polishing composition and related methods
US8795548B1 · kind B1 · utility
1Cited by
2References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 11, 2013 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Apr 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, optionally, a pH adjusting agent; wherein the polishing composition exhibits a silicon removal rate of at least 300 nm/min. Also provided are methods of making and using the chemical mechanical polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.