Semiconductor package having support member
US8796861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2012 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Sep 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor packages including a substrate, a plurality of first semiconductor chips stacked on the substrate, a second semiconductor chip interposed between the substrate and a lowermost semiconductor chip among the first semiconductor chips, and a supporting member disposed between the substrate and the lowermost semiconductor chip among the first semiconductor chips to support the first semiconductor chips, may be provided. The supporting member may include a passive element such as a capacitor, a resistor, or an inductor. By including the supporting member, the semiconductor packages may achieve a smaller planar size and have an improved tolerance for subsequent interconnections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.