Structure of MEMS electroacoustic transducer and fabricating method thereof
US8798291B2 · kind B2 · utility
0Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2008 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Aug 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure of a micro-electro-mechanical systems (MEMS) electroacoustic transducer includes a substrate, a diaphragm, a silicon material layer, and a conductive pattern. The substrate includes an MEMS device region. The diaphragm has openings, and is disposed in the MEMS device region. A first cavity is formed between the diaphragm and the substrate. The silicon material layer is disposed on the diaphragm and seals the diaphragm. The conductive pattern is disposed beneath the diaphragm in the MEMS device region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.