Bonding apparatus
US8800843B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2010 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Sep 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding apparatus includes an ultrasonic horn configured to vibrate longitudinally in resonance with the vibration of an ultrasonic vibrator; a capillary attached at an anti-node of the vibration of the ultrasonic horn; a flange provided at a node of the vibration of the ultrasonic horn; a bonding arm; a load sensor attached between the center of rotation of the bonding arm and a flange mounting surface; and a vibration load detection unit for extracting a signal obtained by causing a signal that is detected with the load sensor to pass a signal within a frequency range around the vibrational frequency of the ultrasonic vibrator through a band-pass filter, whereby the bonding apparatus can detect the vibration load at a tip end of the capillary in the direction along the central axis of the ultrasonic horn with a simple structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.