Semiconductor wafer isolated transfer chuck
US8800998B2 · kind B2 · utility
3Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2011 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Mar 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.