Patent · US Active

Reduction of a process volume of a processing chamber using a nested dynamic inert volume

US8801950B2 · kind B2 · utility

13Cited by
15References
19Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 23, 2012
Grant dateAug 12, 2014
Priority date
Expiry dateSep 7, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/68742
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A substrate processing chamber includes a lift actuator that moves a pedestal between a substrate loading position and a substrate processing position. An adjustable seal defines an expandable sealed volume between a bottom surface of the pedestal and a bottom surface of the substrate processing chamber and is moveable between the substrate loading position and the substrate processing position. When the pedestal is in the substrate processing position, the pedestal and the adjustable seal define a first inert volume and a first process volume. When the pedestal is in the substrate loading position, the pedestal and the adjustable seal define a second inert volume and a second process volume. The second inert volume is less than the first inert volume and the second process volume is greater than the first process volume.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.