Method of manufacturing semiconductor package having no chip pad
US8802498B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Mar 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor package having no chip pad includes preparing a polyimide tape on which an adhesive layer is arranged; forming lead members on the adhesive layer so as to form a plurality of semiconductor packages in a matrix form; attaching the polyimide tape to a carrier; performing wire bonding to mount semiconductor chips on the polyimide tape and connect the lead members and the semiconductor chips; forming an encapsulation member to encapsulate the semiconductor chips, the lead members, and wires; detaching the encapsulation member from the carrier and the polyimide tape; forming conductive layers each on a surface of the lead member exposed through a surface of the encapsulation member; and performing a singulation process on the encapsulation member with the conductive layers formed thereon to define unit semiconductor packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.