Light emitting diode package and method of fabricating the same
US8803185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Feb 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
Abstract
A light emitting diode package and a method of fabricating the same. The package includes a light emitting diode chip having a first surface and a second surface opposing the first surface, a metal frame (or TAB tape) having leads connected to the light emitting diode chip, and a light-pervious encapsulant encapsulating the light emitting diode chip, wherein the second surface of the chip is exposed from the first light-pervious encapsulant. The metal frame (or TAB tape) connects the light emitting diode chip to an external circuit board. The LED package does not need wire-bonding process. A method of fabricating a light emitting diode package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.