Circuit structure and manufacturing method thereof
US8803295B2 · kind B2 · utility
1Cited by
0References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 12, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Jul 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.