Removing and segregating components from printed circuit boards
US8807189B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 2012 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Dec 28, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1939
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.