Method of manufacturing semiconductor device and substrate processing apparatus
US8809204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2012 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Nov 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device, the method comprising: forming an oxide film on a substrate by alternately repeating: (a) forming an element-containing layer on the substrate by supplying a source gas containing an element into a process vessel accommodating the substrate; and (b) changing the element-containing layer to an oxide layer by supplying an oxygen-containing gas and a hydrogen-containing gas into the process vessel having an inside pressure lower than atmospheric pressure, reacting the oxygen-containing gas with the hydrogen-containing gas to generate an atomic oxygen, and oxidizing the element-containing layer by the atomic oxygen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.