Wiring board, semiconductor device, and method for manufacturing wiring board
US8810007B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 17, 2012 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | May 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.