Bond ring for a first and second substrate
US8810027B2 · kind B2 · utility
7Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2010 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Apr 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present disclosure provides a device having a plurality of bonded substrates. The substrates are bonded by a first bond ring and a second bond ring. In an embodiment, the first bond ring is a eutectic bond and the second bond ring is at least one of an organic material and a eutectic bond. The second bond ring encircles the first bond ring. The first bond ring provides a hermetic region of the device. In a further embodiment, a plurality of wafers are bonded which include a third bond ring disposed at the periphery of the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.