Semiconductor manufacturing process modules
US8812150B2 · kind B2 · utility
12Cited by
57References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Apr 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided. The method includes disposing a plurality of robotic facilities to form a semiconductor handling system, controlling the semiconductor handling system with a controller to handoff a workpiece between neighboring robotic facilities, and providing a software interface for the controller, wherein the software interface permits a user to view alternate configurations of the handling system in order to optimize a characteristic of the handling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.