Method of manufacturing semiconductor device and method of cleaning semiconductor substrate
US8815017B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
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Key dates
| Filing date | Jul 26, 2013 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Jul 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/015
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device includes: holding a semiconductor substrate with a surface inclined with respect to the vertical direction and the horizontal direction; and immersing the semiconductor substrate in a cleaning solution including an acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.