Composition and method for polishing bulk silicon
US8815110B2 · kind B2 · utility
1Cited by
31References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2010 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | May 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02024
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increase the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.