Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer
US8815387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2004 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Nov 22, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The object of the present invention is to provide a copper foil with an ultra thin resin layer for a printed wiring board without roughening treatment. In order to achieve the object, there is adopted a copper foil with an ultra thin adhesive layer for a printed wiring board 1 or the like, which is a copper foil provided with an ultra thin primer resin layer for securing good laminating adhesiveness with a resin base material on one side of a copper foil 3 without roughening treatment, characterized in that a silane coupling agent layer 2 is formed on a surface of the copper foil without the roughening treatment having a surface roughness (Rz) of 2 μm or below, and an ultra thin primer resin layer 4 having a converted thickness of 1 to 5 μm is formed on the silane coupling agent layer 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.