Semiconductor package and method of fabricating the same
US8815731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2011 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Dec 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a method for fabricating the same. The semiconductor package includes a first substrate including a first pad, a second substrate spaced apart from the first substrate and where a second pad is formed to face the first pad, a first bump electrically connecting the first pad to the second pad, and a second bump mechanically connecting the first substrate to the second substrate is disposed between the first substrate where the first pad is not formed and the second substrate where the second pad is not formed. A coefficient of thermal expansion (CTE) of the second bump is smaller than that of the first bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.