Electronic device packages and methods of manufacturing the same
US8816480B2 · kind B2 · utility
1Cited by
4References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2012 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Dec 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electronic device package includes a package substrate including a frame portion and a cantilever portion surrounded by the frame portion, at least one semiconductor chip mounted on the cantilever portion, and a molding member disposed on the package substrate to cover the at least one semiconductor chip. The cantilever portion has a first edge connected to the frame portion and declines from the first edge toward a second edge located opposite to the first edge. Related methods are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.