Semiconductor device
US8816493B2 · kind B2 · utility
1Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2013 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Jun 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6644
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a substrate; a semiconductor element on the substrate; an interconnection on the substrate and electrically connected to the semiconductor element; a window frame member on the substrate, surrounding the semiconductor element, and in contact with the interconnection; and a sealing window bonded to the window frame member and encapsulating the semiconductor element. The window frame member is a low melting glass and has a sheet resistance of 106-1010 Ω/□.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.