Inspection system

US8817089B2 · kind B2 · utility

Assignee

• HSEB Dresden GmbH · DE

Inventors

• Bernd Srocka · Berlin, DE
• Marko Doring · Erfurt, DE

Key dates

• Filing date: Apr 28, 2010
• Grant date: Aug 26, 2014
• Expiry date: Apr 2, 2031

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N21/89
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An inspection system for flat objects, especially wafers and dies, including: a handling system for loading objects into the inspection system; a sensor assembly for receiving images or measuring values of the object surface or parts of the object surface; a driving assembly for generating a relative movement between the objects and the sensor assembly, where a movement is effected between objects relative to the sensor assembly along a first trajectory; wherein at least one further sensor assembly is provided, and the driving assembly is adapted to generate a further relative movement, where a movement of different objects relative to the sensor assembly can be generated on at least a second trajectory in order to allow at least two objects to be treated simultaneously.