Electronic component mounting system and electronic component mounting method
US8817487B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2010 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Apr 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are an electronic component mounting system and an electronic component mounting method capable of ensuring high connection reliability. An electronic component mounting system (1) includes a component mounting section which includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), and a reflow device (M4), and mounts an electronic component on a main substrate (4), and a substrate connection section which includes a bonding material supply/substrate mounting device (M5) and a thermal compression device (M6), and connects the main substrate (4) with the component mounted thereon and a module substrate (5) to each other. A configuration is used in which a substrate conveying mechanism (3) of the reflow device (M4) on the lowermost stream side of the component mounting section and a substrate conveying mechanism (3) of the bonding material supply/substrate mounting device (M5) of the substrate connection section are connected directly to each other or are linked to each other by a conveying path through another conveying means. Thus, the main substrate (4) after reflow can be transferred immediately to a substrate connection…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.