Wafer unloading system and wafer processing equipment including the same
US8821219B2 · kind B2 · utility
1Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Mar 25, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.