Shielding and potting for electrical circuits
US8822844B1 · kind B1 · utility
8Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2010 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Oct 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for shielding an electrical circuit may include depositing a potting material upon the electrical circuit. The method may include providing a path to a ground of the electrical circuit. The method may also include depositing an electrically conductive coating upon the electrical circuit and over the potting material. The method may further include connecting the electrically conductive coating to the ground of the electrical circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.