Mark T. Dimke
5Patents
3h-index
8Co-inventors
50Inventor score
Filing activity: May 23, 2000 → May 3, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6211389A | Methods of reducing the chloride content of epoxy compounds | Chemistry; Metallurgy | 8 | Expired |
| US8822844B1 | Shielding and potting for electrical circuits | Electricity | 8 | Active |
| US6677468B1 | Methods of reducing chloride content in epoxy compounds | Chemistry; Metallurgy | 5 | Expired |
| US8640619B1 | Use of polyamide thermal plastics as low cost electronics potting compounds for munitions applications | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US11948855B1 | Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.