Interposer having an inductor
US8823133B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Mar 29, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of a multichip module is disclosed. For this embodiment of a multichip module, a semiconductor die and an interposer are included. The interposer has conductive layers, dielectric layers, and a substrate. Internal interconnect structures couple the semiconductor die to the interposer. External interconnect structures are for coupling the interposer to an external device. A first inductor includes at least a portion of one or more of the conductive layers of the interposer. A first end of the first inductor is coupled to an internal interconnect structure of the internal interconnect structures. A second end of the first inductor is coupled to an external interconnect structure of the external interconnect structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.