Semiconductor package and stacked semiconductor package having the same
US8823158B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2012 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Oct 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.