Electronic device package and method for fabricating the same
US8823179B2 · kind B2 · utility
4Cited by
2References
24Claims
0Family size
Inventors
Key dates
| Filing date | Jun 13, 2008 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Aug 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention provides an electronic device package, which includes a chip having a first surface and an opposite second surface and a trench extending into a body of the chip along a direction from the second surface to the first surface, wherein a bottom portion of the trench includes at least two contact holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.