Semiconductor packages
US8823185B2 · kind B2 · utility
5Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Feb 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.