Semiconductor apparatus and method of testing and manufacturing the same
US8823409B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2010 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Sep 26, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06596
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes: a semiconductor chip, wherein a conductive layer is formed at one side of the semiconductor chip and one or more of probe pads are formed at the other side thereof; a plurality of through-silicon vias (TSVs), wherein one side of each of the plurality of TSVs is coupled to the conductive layer and the other side of one or more of the plurality of TSVs is coupled to the probe pad; a plurality of latch units each configured to be assigned to the plurality of corresponding TSVs and store a test signal, wherein the test signal is inputted via the probe pad and is transferred via the plurality of corresponding TSVs to the plurality of assigned latch units, respectively; and a signal combination unit configured to combine a plurality of signals stored in the plurality of latch units to output the result as an error detection signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.