Process for cleaning wafers
US8828144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2012 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Jun 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for cleaning a wafer having an uneven pattern at its surface. The process includes at least the steps of: cleaning the wafer with a cleaning liquid; substituting the cleaning liquid retained in recessed portions of the wafer with a water-repellent liquid chemical after cleaning; and drying the wafer, wherein the cleaning liquid contains 80 mass % or greater of a solvent having a boiling point of 55 to 200° C., and wherein the water-repellent liquid chemical supplied in the substitution step has a temperature of not lower than 40° C. and lower than a boiling point of the water-repellent liquid chemical thereby imparting water repellency at least to surfaces of the recessed portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.