Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)—group 13 (IIIA)—Group 16 (VIA)

US8828278B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Torsten Voss · Glienicke, DE
• Joerg Schulze · Ludwigshafen, DE
• Andreas Kirbs · Berlin, DE
• Aylin Machmor · Riedstadt, DE
• Heiko Brunner · Berlin, DE
• Bernd Froese · Berlin, DE
• Ulrike Engelhardt · Ketsch, DE

Key dates

• Filing date: May 29, 2009
• Grant date: Sep 9, 2014
• Expiry date: Feb 23, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/541
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to electroplating additives for the deposition of a group IB metal/binary or ternary group IB-group IIIA/ternary, quaternary or pentanary group IB-group IIIA-group VIA alloy on substrates useful for thin film solar cells. The additives are thiourea compounds or derivatives which have the general formula (A):wherein X1 and X2 may be the same or different and are selected from the group consisting of arylene and heteroarylene; FG1 and FG2 may be the same or different or are selected from the group consisting of —S(O)2OH, —S(O)OH, —COOH, —P(O)2OH and primary, secondary and tertiary amino groups and salts and esters thereof; R is selected from the group consisting of alkylene, arylene or heteroarylene and n and m are integers from 1 to 5.