Optoelectronic semiconductor chip and method for fabricating an optoelectronic semiconductor chip

US8829560B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Franz Eberhard · Kilchberg, CH
• Wolfgang Schmid · Regensburg, DE

Key dates

• Filing date: Dec 8, 2010
• Grant date: Sep 9, 2014
• Expiry date: Jan 18, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/84

Abstract

An optoelectronic semiconductor chip, comprising: a radiation out-coupling side (102, 910); a contact connection (104, 1000); a metal contact material (210, 912) applied to the radiation out-coupling side (102, 910) and a metal conductive connection (106, 500, 914) applied to the contact material (210, 912) and which is connected to the contact connection (104, 1000).