Light-emitting device package and method of manufacturing the same
US8829691B2 · kind B2 · utility
0Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2011 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Jan 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device package includes: a package body on which a mount portion and a terminal portion are disposed; a light-emitting device chip that is mounted on the mount portion; and a bonding wire that electrically connects an electrode of the light-emitting device chip and the terminal portion. The bonding wire includes a rising portion that rises from the light-emitting device chip to a loop peak, and an extended portion that connects the loop peak and the terminal portion. A first kink portion, which is bent in a direction intersecting a direction in which the rising portion rises, is disposed on the rising portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.