Built-in self-test for interposer
US8832511B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2011 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Nov 9, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/318536
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device includes a first die coupled to an interconnect structure of an interposer. The first die includes a first BIST circuit configured to generate and output test signals to the interconnection structure of the interposer. A second die is coupled to the interconnect structure of the interposer and includes a second BIST circuit configured to receive signals from the interconnection structure of the interposer in response to the first BIST circuit transmitting the test signals. The second BIST circuit is configured to compare the signals received from the interconnection structure of the interposer to reference signals generated by the second BIST circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.