Patent · US Active

Apparatus and method of separating wafer from carrier

US8834662B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Chien Ling Hwang · Baoshan, TW
Lin-Wei Wang · Langfang, CN
Chung-Shi Liu · Baoshan, TW

Key dates

Filing date	Mar 22, 2012
Grant date	Sep 16, 2014
Priority date	—
Expiry date	Apr 18, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1978
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.