Lin-Wei Wang
9Patents
2h-index
15Co-inventors
44Inventor score
Filing activity: Jul 22, 2010 → Sep 28, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9735039B2 | Apparatus for separating wafer from carrier | Emerging Cross-Sectional Technologies | 6 | Active |
| US8616433B2 | Forming low stress joints using thermal compress bonding | Emerging Cross-Sectional Technologies | 2 | Active |
| US8940618B2 | Method and device for cutting semiconductor wafers | Electricity | 1 | Active |
| US9700950B2 | Innovative multi-purpose dipping plate | Performing Operations; Transporting | 1 | Active |
| US9434967B2 | Microbial culture medium and cultural method | Chemistry; Metallurgy | 1 | Active |
| US11692628B2 | Sealing device for gas-liquid two-phase fluid medium under variable working conditions | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US8702871B2 | Package assembly cleaning process using vaporized solvent | Electricity | 0 | Active |
| US8360303B2 | Forming low stress joints using thermal compress bonding | Emerging Cross-Sectional Technologies | 0 | Active |
| US8834662B2 | Apparatus and method of separating wafer from carrier | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.