Method for producing a two-chip assembly and corresponding two-chip assembly

US8835222B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Mathias Bruendel · Stuttgart, DE
• Frieder Haag · Wannweil, DE
• Jens Frey · Echterdingen, DE
• Rolf Speicher · Lörrach, DE
• Juergen Fritz · Karlsruhe, DE
• Lutz Rauscher · Reutlingen, DE

Key dates

• Filing date: Sep 20, 2012
• Grant date: Sep 16, 2014
• Expiry date: Feb 22, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.