Assembly and electronic devices including the same

US8835915B2 · kind B2 · utility

Assignee

• 3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

• Robert S. Clough · Windom, US
• James C. Novack · Windom, US
• David H. Redinger · Afton, US
• Guoping Mao · Woodbury, US
• Michael E. Griffin · Maplewood, US

Key dates

• Filing date: Nov 17, 2011
• Grant date: Sep 16, 2014
• Expiry date: Nov 17, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K85/623

Abstract

An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a crosslinked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed.