David H. Redinger
22Patents
3h-index
27Co-inventors
59Inventor score
Filing activity: May 29, 2009 → Jun 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9961418B2 | Data communication appratus, system, and method | Electricity | 15 | Active |
| US8232550B2 | Mixed solvent systems for deposition of organic semiconductors | Electricity | 7 | Active |
| US9104100B2 | Photoresists containing polymer-tethered nanoparticles | Mechanical Engineering; Lighting; Heating | 7 | Active |
| US11016047B2 | Temperature-corrected control data for verifying of structural integrity of materials | Physics | 3 | Active |
| US10983081B2 | Electrode placement for verifying structural integrity of materials | Physics | 2 | Active |
| US10816495B2 | Verifying structural integrity of materials | Physics | 2 | Active |
| US11371952B2 | Verifying structural integrity of materials | Physics | 1 | Active |
| US10590899B2 | Fuel injectors with improved coefficient of fuel discharge | Emerging Cross-Sectional Technologies | 1 | Active |
| US11060993B2 | Suppressing thermally induced voltages for verifying structural integrity of materials | Physics | 1 | Active |
| US8956555B2 | Silylethynyl pentacene compounds and compositions and methods of making and using the same | Electricity | 1 | Active |
| US11150209B2 | Verifying structural integrity of materials using electrical properties | Human Necessities | 0 | Active |
| US11609202B2 | Electrode placement for verifying structural integrity of materials | Physics | 0 | Active |
| US11105762B2 | Verifying structural integrity of materials using reference impedance | Physics | 0 | Active |
| US8610119B2 | Stability enhancements in metal oxide semiconductor thin film transistors | Electricity | 0 | Active |
| US10873792B2 | Data communication apparatus, system, and method | Electricity | 0 | Active |
| US11609203B2 | Suppressing thermally induced voltages for verifying structural integrity of materials | Physics | 0 | Active |
| US11181498B2 | Temperature-independent verifying of structural integrity of materials using electrical properties | Physics | 0 | Active |
| US8835915B2 | Assembly and electronic devices including the same | Electricity | 0 | Active |
| US11946891B2 | Temperature-corrected control data for verifying of structural integrity of materials | Physics | 0 | Active |
| US11255807B2 | Verifying structural integrity of materials | Physics | 0 | Active |
| US11112374B2 | Verifying structural integrity of materials | Physics | 0 | Active |
| US10412471B2 | Data communication apparatus, system, and method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.