Patent · US Active

Package-on-package assembly with wire bond vias

US8836136B2 · kind B2 · utility

82Cited by

233References

29Claims

0Family size

Assignee

Invensas LLC · US

Inventors

Ellis Chau · San Jose, US
Reynaldo Co · Scotts Valley, US
Roseann Alatorre · San Jose, US
Philip Damberg · Cupertino, US
Wei-Shun Wang · Palo Alto, US
Se Young Yang · San Jose, US
Zhijun Zhao · San Jose, US

Key dates

Filing date	Feb 24, 2012
Grant date	Sep 16, 2014
Priority date	—
Expiry date	Feb 24, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49151
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A microelectronic package can include wire bonds having bases bonded to respective conductive elements on a substrate and ends opposite the bases. A dielectric encapsulation layer extending from the substrate covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds which are uncovered by the encapsulation layer. Unencapsulated portions can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases of adjacent wire bonds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.