Process control and manufacturing method for fan out wafers
US8836780B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Jul 16, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for monitoring a manufacturing process of a fan-out wafer, the method may include acquiring a first set of images of dies after a completion of a first manufacturing stage of a manufacturing process of the fan-out wafer; processing the first set of images to detect defects; performing at least one corrective operation in response to at least one defect detected by processing the first set of images; acquiring a second set of images of dies after a completion of a second manufacturing stage of the manufacturing process of the fan-out wafer, the second manufacturing process follows the first manufacturing process; processing the second set of images to detect defects; and performing at least one corrective operation in response to at least one defect detected by processing the second set of images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.