3D power module package
US8842438B2 · kind B2 · utility
4Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2011 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Aug 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.