Patent · US Active

System and method for reducing temperature variation during burn in

US8843344B2 · kind B2 · utility

0Cited by

69References

20Claims

0Family size

Inventors

Eric Chen-Li Sheng · San Jose, US
David H. Hoffman · Sunnyvale, US
John Laurence Niven · Livermore, US

Key dates

Filing date	Jul 20, 2009
Grant date	Sep 23, 2014
Priority date	—
Expiry date	Feb 18, 2030

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2879
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.