Modular electronic header assembly and methods of manufacture
US8845367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Jul 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.