Substrate polishing apparatus, substrate polishing method, and apparatus for regulating temperature of polishing surface of polishing pad used in polishing apparatus
US8845391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2010 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Sep 30, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.