Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder
US8845826B2 · kind B2 · utility
8Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2008 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Jul 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3463
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder contains Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.