Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof

US8847247B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karl Weidner · Birkenfeld, DE
• Ralph Wirth · Lappersdorf, DE
• Axel Kaltenbacher · Ingolstadt, DE
• Walter Wegleiter · Nittendorf, DE
• Bernd Barchmann · Regensburg, DE
• Oliver Wutz · Regensburg, DE
• Jan Marfeld · Regensburg, DE

Key dates

• Filing date: Aug 6, 2010
• Grant date: Sep 30, 2014
• Expiry date: Aug 6, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An optoelectronic module is provided which comprises a first semiconductor body (2) with a radiation exit side (2a) on which an electrical connection region (21, 22) is arranged. The first semiconductor body (2) is arranged with its side opposite the radiation exit side (2a) on a carrier (1). An insulation material (3) is arranged on the carrier (1) laterally next to the first semiconductor body (2), which material forms a fillet and adjoins the semiconductor body (2) form-fittingly. An insulation layer (4) is arranged at least in places on the first semiconductor body (2) and the insulation material (3), on which layer a planar conductive structure is arranged for planar contacting of the first semiconductor body (2), which conductive structure is electrically conductively connected with the electrical connection region (21, 22). A method of producing such an optoelectronic module is furthermore provided.