Microelectromechanical systems embedded in a substrate
US8847375B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2010 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Oct 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An integrated circuit package includes a microelectromechanical systems (MEMS) device embedded in a packaging substrate. The MEMS device is located on a die embedded in the packaging substrate and covered by a hermetic seal. Low-stress material in the packaging substrate surrounds the MEMS device. Additionally, interconnects may be used as standoffs to reduce stress on the MEMS device. The MEMS device is embedded a distance into the packaging substrate leaving for example, 30-80 microns, between the hermetic seal of the MEMS device and the support surface of the packaging substrate. Embedding the MEMS device results in lower stress on the MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.